Products
MIM & PM parts across six material platforms, plus high density tungsten alloy products.
Copper Alloy Products
- Materials
- Copper, bronze, brass, tungsten copper
- Features
- High thermal conductivity, good electrical conductivity, bacteriostatic properties
- Application
- 5G, electronic components, electrode contact head, etc.
Copper Alloy Products
34 products
Copper Alloy MIM Parts
Copper and tungsten-copper MIM parts for 5G optical modules, electronic packaging thermal management, switch contacts and electrodes.
Tungsten Copper Precision Components
WCu alloy components combining tungsten's hardness and high melting point with copper's electrical and thermal conductivity — electrical contacts, connector terminals, EDM and resistance welding electrodes, and EMI shields.
Copper Thermal Packaging Components
High-conductivity copper and W-Cu thermal packaging parts made by PM/MIM near-net-shape forming — chip heat sink bases, optical transceiver heat spreaders, laser diode coolers and microelectronic mounts.
Copper Alloy Powder Metallurgy Gears
Copper alloy PM gears engineered for motion systems that demand quiet operation, excellent dimensional control and high thermal stability — compacted and sintered to a microstructure far more uniform than cast or machined copper alloys.
Powder Metallurgy Copper Components
PM copper components engineered for high electrical and thermal conductivity, mechanical durability and precision geometry — near-net-shape production with uniform density and minimal porosity.
Copper Alloy Connector Terminals
Precision-engineered copper alloy terminals for high-density electrical systems — MIM near-net-shape production delivers tight tolerances, complex geometry and high surface quality for optimal conductivity and mechanical reliability.
Copper Alloy Electrical Contacts
Copper alloy electrical contacts for applications demanding high conductivity, mechanical robustness and precision geometry — MIM enables miniaturized multi-tier contacts, slots and micro-features with tight tolerances and low material loss.
Copper Alloy Heat Sink
Copper alloy heat sinks for high-efficiency thermal management in compact, high-power electronics — MIM integrates micro-fins, internal channels and optimized flow paths directly into near-net-shape parts.
Copper Alloy Micro Gears
Precision PM/MIM sintered micro gears for high-performance micro drives — high-precision tooth geometry, stable dimensional accuracy with minimal backlash, and cost-efficient millions-level output.
Eccentric Weight
Tungsten alloy eccentric weights for compact vibration motors in consumer electronics, beauty devices and portable instrumentation — high density, ±0.02 mm MIM tolerances and consistent balance at high RPM.
Motor Counterweight
Tungsten alloy motor counterweights for precise mass distribution in compact vibration motors and micro-actuating systems — extreme density, shape accuracy and long service life via MIM/PM.
Oil-impregnated Bronze Bearing
Precision PM/MIM sintered self-lubricating bronze bearings for micro motors — controlled porosity releases oil automatically, with mass-production capability down to Ø0.5 × Ø1.0 × 0.5 mm.
Tungsten Alloy Balancing Weight
Tungsten alloy balancing weights for vibration systems demanding exceptional mass concentration, dimensional accuracy and long-term reliability — the eccentric mass in compact motors from smartphones to medical micro-drives.
Tungsten Alloy EMI Shield
High-density tungsten alloy EMI shields for advanced optical, RF and photonic systems — superior shielding effectiveness over aluminum or stainless steel in miniaturized thin-wall MIM designs.
Tungsten Alloy Precision Parts
Tungsten alloy precision parts for applications demanding extreme mechanical strength, high density and precise dimensional control — MIM/PM near-net-shape forming with ±0.02 mm tolerances and minimal material waste.
Tungsten Copper Electrodes
WCu alloy electrodes combining tungsten's hardness and high melting point with copper's conductivity — outstanding arc erosion resistance, anti-adhesion and heat dissipation for EDM, resistance welding and high-voltage discharge.
Tungsten Copper Heat Sink
Tungsten copper heat sinks for high-efficiency thermal control in extremely compact optical and photonic systems — copper's conductivity plus tungsten's low thermal expansion for stable, warp-free thermal cycling.
Tungsten Copper Packaging Parts
Tungsten copper packaging parts for optical, photonic and semiconductor packaging — balanced thermal spreading and mechanical strength for laser modules, VCSEL arrays and high-density packaging platforms.
Chip Heat Sink Base
High-conductivity copper / W–Cu bases for semiconductor chip and COB cooling — PM/MIM near-net-shape bases with cavities, steps and multi-level surfaces for rapid heat removal, low warpage and reliable die bonding.
Copper Heat Sink
High-conductivity pure copper thermal solutions for electronic cooling — PM/MIM near-net-shape forming enables micro-fins, microchannels and compact high-surface-area designs that machining or extrusion cannot achieve.
Electrical Copper Connector
Precision copper connectors for power & signal transmission — PM/MIM near-net-shape terminals, lugs, pins, sockets and bus connectors with low contact resistance and high mechanical durability.
EML / DFB Thermal Component
High-stability cooling components for EML and DFB laser packaging — W–Cu / high-purity copper chip carriers, submounts and thermal blocks with low thermal drift for wavelength-accurate telecom-grade lasers.
High Power Heat Sink
High-density W–Cu / Cu heat sinks for high-power laser cooling — PM sintering-infiltration parts with rapid heat spreading and low thermal distortion for CW and pulsed industrial, medical and defense lasers.
Laser Diode Heat Sink
Precision W–Cu / Cu heat sinks for high-power laser diode packaging — PM + infiltration + CNC parts with microcavities, steps and mounting geometries that keep LD/VCSEL modules aligned under rapid thermal cycling.
Microelectronic Mount
Engineered mounting platforms for semiconductor chips, laser diodes, photonic sensors and hybrid microelectronic assemblies — PM/MIM near-net-shape mounts with ultra-precise flat surfaces, cavities, slots and metallization.
Optical Transceiver Heat Spreader
High-performance thermal management for high-speed optical modules (QSFP, QSFP-DD, OSFP, CFP) — PM/MIM heat spreaders with micro-fins, thin walls and tight tolerances for transceivers up to 800G.
Pump Laser Diode Cooler
Precision thermal coolers for pump laser diode modules — W–Cu / high-purity copper stepped bases and micro-cavities with AuSn soldering compatibility, stabilizing wavelength and power output under rapid thermal changes.
Pure Copper Electrode
High-conductivity pure copper electrodes for welding, EDM and power applications — PM near-net-shape parts with uniform density, low resistivity and low wear rate for repeatable high-current performance.
RF Heatsink
High-conductivity thermal components for RF & microwave devices — W–Cu / pure copper / PM composite bases, tabs and housings with CTE matched to GaN, GaAs and SiC for stable gain and low noise.
TO-Pedestal
Tungsten–copper & copper pedestals for TO-can power device packaging — PM sintered, infiltrated and CNC-machined bases ensuring heat conduction, hermetic sealing and dimensional stability for TO-3/TO-5/TO-18/TO-220 modules.
Tungsten Copper Electronic Package Housing
W–Cu electronic package housings for high-power semiconductor modules, RF devices and hermetically sealed electronics — PM near-net-shape housings with CTE tailored to Si, GaN, GaAs and SiC.
Tungsten Copper IC Packaging
W–Cu IC packaging substrates for power semiconductor chips, RF amplifiers and hermetic device carriers — PM/MIM parts with micro-channels, stepped regions and cavity structures, CTE-tunable to Si, SiC, GaN or GaAs.
Tungsten Copper Substrate
High-integrity W–Cu substrates for devices generating intense localized heat — laser diode stacks, power modules, RF circuits and photonics equipment, with thin high-strength profiles and multilevel PM/MIM geometries.
Tungsten Copper Thermal Substrate
High-density W–Cu heat spreading substrates for power & RF devices — PM sintering-infiltration plates, blocks and spreader blanks with tailored CTE, tight tolerances and minimal warpage for hermetic packaging.
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