Copper Thermal Packaging Components
High-conductivity copper and W-Cu thermal packaging parts made by PM/MIM near-net-shape forming — chip heat sink bases, optical transceiver heat spreaders, laser diode coolers and microelectronic mounts.
- Materials
- Pure copper, tungsten copper (W-Cu)
- Features
- High thermal conductivity, CTE matching, low warpage, miniaturized complex geometries, plating/soldering/wire-bonding compatible
- Application
- Power ICs and MOSFET modules, RF chips, LED/COB packaging, optical transceivers, pump laser diodes, high-performance computing.
Specifications
| Parameter | Value |
|---|---|
| Material | Pure copper / W-Cu composite |
| Process | PM / MIM near-net-shape + precision CNC |
| Key Property | High thermal conductivity, CTE matching |
| Surface Compatibility | Electroplating, soldering, wire bonding |
Frequently Asked Questions
What materials are used for thermal packaging parts?
Pure copper for maximum thermal conductivity, and W-Cu composites where a low, tailorable coefficient of thermal expansion (CTE) is needed to match chips and ceramic substrates. Parts are formed by PM/MIM near-net-shape plus precision CNC finishing for critical surfaces.
Which applications do these parts serve?
Chip heat sink bases, optical transceiver heat spreaders, laser diode coolers and microelectronic mounts — covering power ICs and MOSFET modules, RF chips, LED/COB packaging, pump laser diodes and high-performance computing. PM/MIM forming supports miniaturized, complex geometries with low warpage.
Are the parts compatible with plating, soldering and wire bonding?
Yes — surface compatibility with electroplating, soldering and wire bonding is a design requirement for this product line. Nickel and gold finishes are common for die-attach and wire-bond surfaces; specify your assembly process and we will match the finish accordingly.
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