Power Electronics
PM and MIM components are widely used in power electronics and LED systems for their exceptional heat dissipation and dimensional accuracy. Ultrafine metal powders enable high-performance thermal interfaces and structural parts that withstand repeated thermal cycles.
Overview
PM and MIM components are widely used in power electronics and LED systems for their exceptional heat dissipation and dimensional accuracy. Ultrafine metal powders enable high-performance thermal interfaces and structural parts that withstand repeated thermal cycles.
Typical Parts
Related Products
Tungsten Copper Heat Sink
Materials: Tungsten copper (WCu) composite
Rapid heat transfer from sensitive chips, structural reinforcement under thermal stress, micro-channels and thin-wall structures via MIM, low thermal fatigue and oxidation resistance
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Copper Thermal Packaging Components
Materials: Pure copper, tungsten copper (W-Cu)
High thermal conductivity, CTE matching, low warpage, miniaturized complex geometries, plating/soldering/wire-bonding compatible
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Chip Heat Sink Base
Materials: Pure copper, tungsten copper (W–Cu)
High thermal conductivity, low warpage & stable flatness, CTE matching, PM/MIM near-net-shape miniaturized geometries, electroplating/soldering/wire-bonding compatible
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Tungsten Copper Substrate
Materials: Tungsten copper (W–Cu)
Low thermal resistance with sustained flatness, strength at thinner profiles, multilevel/recessed/stepped geometries, Ni/Au & Ni/Ag plating, vacuum brazing and mirror-lapping compatible
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Tungsten Copper Electronic Package Housing
Materials: Tungsten copper (W–Cu)
High thermal conductivity, tailored CTE matching, dimensional stability under thermal cycling, high density & strength, reliable hermetic sealing
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High Power Heat Sink
Materials: Tungsten copper (W–Cu), high-conductivity copper
High thermal conductivity, low thermal distortion, high density & structural stability, micro-channel/cavity capability, Au/Ni plating & water-cooling interfaces
View DetailsOther Applications
- Consumer Electronics (3C)
- Smart Wearables
- Automotive
- Power Tools
- Medical Devices
- Smart Locks & Hardware
- Bathroom Hardware
- 5G & Optical Communications
- Sports & Counterweights
- Sensors & Magnetic Parts
- Aerospace & Robotics
- Electrical Conduction
- Transmission Systems
- Radiation Protection
- Mechanical Parts
- Industrial Machinery
- Motors & Inductors
- Lightweight Structures
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