Tungsten Copper Heat Sink
Tungsten copper heat sinks for high-efficiency thermal control in extremely compact optical and photonic systems — copper's conductivity plus tungsten's low thermal expansion for stable, warp-free thermal cycling.
- Materials
- Tungsten copper (WCu) composite
- Features
- Rapid heat transfer from sensitive chips, structural reinforcement under thermal stress, micro-channels and thin-wall structures via MIM, low thermal fatigue and oxidation resistance
- Application
- Optical packaging for LDs, photodiodes and transceivers, power electronics (MOSFETs, IGBTs), photonic integrated circuits and laser modules, semiconductor test fixtures.
Specifications
| Parameter | Value |
|---|---|
| Material | Tungsten copper (WCu) composite |
| Process | MIM near-net-shape forming |
Frequently Asked Questions
What materials and process are used for Tungsten Copper Heat Sink?
Tungsten Copper Heat Sink is made from Tungsten copper (WCu) composite and is formed by MIM/PM (metal injection molding / powder metallurgy) near-net-shape and sintered to a relative density of ≥ 98%, which keeps mechanical properties close to wrought material.
What are the key specifications of Tungsten Copper Heat Sink?
Typical specifications: Material: Tungsten copper (WCu) composite; Process: MIM near-net-shape forming. The full parameter list is in the specifications table on this page; custom requirements can be discussed against your drawing.
What is the MOQ and lead time for Tungsten Copper Heat Sink?
MOQ is 1000 pcs. Mold lead time is about 20 days (mold fee typically RMB 20–40k depending on part geometry), and production lead time is about 7 days once the mold is validated; secondary processing adds 3–5 days.
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