Chip Heat Sink Base — chip-heat-sink-base-r01.jpg

Chip Heat Sink Base

High-conductivity copper / W–Cu bases for semiconductor chip and COB cooling — PM/MIM near-net-shape bases with cavities, steps and multi-level surfaces for rapid heat removal, low warpage and reliable die bonding.

Materials: Pure copper, tungsten copper (W–Cu)
Features: High thermal conductivity, low warpage & stable flatness, CTE matching, PM/MIM near-net-shape miniaturized geometries, electroplating/soldering/wire-bonding compatible
Application: Power ICs & MOSFET modules, RF chips & telecom devices, LED & COB packaging, high-performance computing (CPU/GPU bases), industrial embedded electronics.

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FAQ

Frequently Asked Questions

What materials and process are used for Chip Heat Sink Base?

Chip Heat Sink Base is made from Pure copper, tungsten copper (W–Cu) and is formed by MIM/PM (metal injection molding / powder metallurgy) near-net-shape and sintered to a relative density of ≥ 98%, which keeps mechanical properties close to wrought material.

What tolerances can Chip Heat Sink Base hold?

Typical as-sintered dimensional tolerance is ±0.3–0.5% of the dimension. Tighter tolerances are achievable with secondary sizing or machining, agreed per part during quoting.

What is the MOQ and lead time for Chip Heat Sink Base?

MOQ is 1000 pcs. Mold lead time is about 20 days (mold fee typically RMB 20–40k depending on part geometry), and production lead time is about 7 days once the mold is validated; secondary processing adds 3–5 days.