Copper Heat Sink — copper-heat-sink-d02.jpg
Copper Heat Sink — copper-heat-sink-d01.jpg
Copper Heat Sink — copper-heat-sink-d04.jpg
Copper Alloy Products

Copper Heat Sink

High-conductivity pure copper thermal solutions for electronic cooling — PM/MIM near-net-shape forming enables micro-fins, microchannels and compact high-surface-area designs that machining or extrusion cannot achieve.

Materials
High-purity copper
Features
Superior thermal conductivity, micro-fin/channel capability, high surface area designs, thermal cycling resistance, cost-effective mass production
Application
Power electronics (DC/DC modules, IGBTs, MOSFETs, LED drivers), high-density computing (CPU/GPU/servers), automotive & aerospace power modules, RF & communication systems, industrial IoT devices.
FAQ

Frequently Asked Questions

What materials and process are used for Copper Heat Sink?

Copper Heat Sink is made from High-purity copper and is formed by MIM/PM (metal injection molding / powder metallurgy) near-net-shape and sintered to a relative density of ≥ 98%, which keeps mechanical properties close to wrought material.

What tolerances can Copper Heat Sink hold?

Typical as-sintered dimensional tolerance is ±0.3–0.5% of the dimension. Tighter tolerances are achievable with secondary sizing or machining, agreed per part during quoting.

What is the MOQ and lead time for Copper Heat Sink?

MOQ is 1000 pcs. Mold lead time is about 20 days (mold fee typically RMB 20–40k depending on part geometry), and production lead time is about 7 days once the mold is validated; secondary processing adds 3–5 days.