Laser Diode Heat Sink
Precision W–Cu / Cu heat sinks for high-power laser diode packaging — PM + infiltration + CNC parts with microcavities, steps and mounting geometries that keep LD/VCSEL modules aligned under rapid thermal cycling.
- Materials
- Tungsten copper (W–Cu), high-purity copper
- Features
- Efficient heat dissipation, low thermal deformation, high-density W–Cu for thermal cycling, Au/Ni plating, soldering & eutectic bonding compatible
- Application
- Laser diode modules (LD, FP, DFB), VCSEL & optical communication lasers, industrial & medical laser assemblies, high-power LD arrays, precision optoelectronics.
Frequently Asked Questions
What materials and process are used for Laser Diode Heat Sink?
Laser Diode Heat Sink is made from Tungsten copper (W–Cu), high-purity copper and is formed by MIM/PM (metal injection molding / powder metallurgy) near-net-shape and sintered to a relative density of ≥ 98%, which keeps mechanical properties close to wrought material.
What tolerances can Laser Diode Heat Sink hold?
Typical as-sintered dimensional tolerance is ±0.3–0.5% of the dimension. Tighter tolerances are achievable with secondary sizing or machining, agreed per part during quoting.
What is the MOQ and lead time for Laser Diode Heat Sink?
MOQ is 1000 pcs. Mold lead time is about 20 days (mold fee typically RMB 20–40k depending on part geometry), and production lead time is about 7 days once the mold is validated; secondary processing adds 3–5 days.
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