Tungsten Copper Packaging Parts
Tungsten copper packaging parts for optical, photonic and semiconductor packaging — balanced thermal spreading and mechanical strength for laser modules, VCSEL arrays and high-density packaging platforms.
- Materials
- Tungsten copper (WCu) composite
- Features
- Efficient junction cooling and reduced thermal drift, fine-geometry MIM structures with consistent thin-wall material distribution, alignment features and integrated thermal pathways
- Application
- Photonic packaging for VCSELs, laser diodes, PDs, TO-packages and PICs; power amplification and RF modules; high-power laser systems; advanced optoelectronics.
Specifications
| Parameter | Value |
|---|---|
| Material | Tungsten copper (WCu) composite |
| Process | MIM + proprietary powder engineering |
Frequently Asked Questions
What materials and process are used for Tungsten Copper Packaging Parts?
Tungsten Copper Packaging Parts is made from Tungsten copper (WCu) composite and is formed by MIM/PM (metal injection molding / powder metallurgy) near-net-shape and sintered to a relative density of ≥ 98%, which keeps mechanical properties close to wrought material.
What are the key specifications of Tungsten Copper Packaging Parts?
Typical specifications: Material: Tungsten copper (WCu) composite; Process: MIM + proprietary powder engineering. The full parameter list is in the specifications table on this page; custom requirements can be discussed against your drawing.
What is the MOQ and lead time for Tungsten Copper Packaging Parts?
MOQ is 1000 pcs. Mold lead time is about 20 days (mold fee typically RMB 20–40k depending on part geometry), and production lead time is about 7 days once the mold is validated; secondary processing adds 3–5 days.
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