EML / DFB Thermal Component
High-stability cooling components for EML and DFB laser packaging — W–Cu / high-purity copper chip carriers, submounts and thermal blocks with low thermal drift for wavelength-accurate telecom-grade lasers.
- Materials
- Tungsten copper (W–Cu), high-purity copper, PM-engineered alloys
- Features
- High thermal conductivity, low thermal drift, controlled CTE, PM/MIM miniaturized package geometries, Au/Ni plating & hermetic sealing compatible
- Application
- EML and DFB laser modules, high-speed optical transceivers, CATV/DWDM/CWDM and coherent optical modules, telecom & datacom laser assemblies, precision optical submounts.
Frequently Asked Questions
What materials and process are used for EML / DFB Thermal Component?
EML / DFB Thermal Component is made from Tungsten copper (W–Cu), high-purity copper, PM-engineered alloys and is formed by MIM/PM (metal injection molding / powder metallurgy) near-net-shape and sintered to a relative density of ≥ 98%, which keeps mechanical properties close to wrought material.
What tolerances can EML / DFB Thermal Component hold?
Typical as-sintered dimensional tolerance is ±0.3–0.5% of the dimension. Tighter tolerances are achievable with secondary sizing or machining, agreed per part during quoting.
What is the MOQ and lead time for EML / DFB Thermal Component?
MOQ is 1000 pcs. Mold lead time is about 20 days (mold fee typically RMB 20–40k depending on part geometry), and production lead time is about 7 days once the mold is validated; secondary processing adds 3–5 days.
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