Tungsten Alloy EMI Shield — tungsten-alloy-emi-shield-d01.jpg

Tungsten Alloy EMI Shield

High-density tungsten alloy EMI shields for advanced optical, RF and photonic systems — superior shielding effectiveness over aluminum or stainless steel in miniaturized thin-wall MIM designs.

Materials: High-density tungsten alloy
Features: High-density EMI attenuation, thin-wall intricate cavity designs via MIM, thermal endurance through soldering and reflow, customizable density and mounting geometries
Application: 400G/800G/1.6T optical transceivers, RF & microwave photonics, medical & aerospace electronics, high-speed digital modules.

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FAQ

Frequently Asked Questions

What materials and process are used for Tungsten Alloy EMI Shield?

Tungsten Alloy EMI Shield is made from High-density tungsten alloy and is formed by MIM/PM (metal injection molding / powder metallurgy) near-net-shape and sintered to a relative density of ≥ 98%, which keeps mechanical properties close to wrought material.

What tolerances can Tungsten Alloy EMI Shield hold?

Typical as-sintered dimensional tolerance is ±0.3–0.5% of the dimension. Tighter tolerances are achievable with secondary sizing or machining, agreed per part during quoting.

What is the MOQ and lead time for Tungsten Alloy EMI Shield?

MOQ is 1000 pcs. Mold lead time is about 20 days (mold fee typically RMB 20–40k depending on part geometry), and production lead time is about 7 days once the mold is validated; secondary processing adds 3–5 days.