Pump Laser Diode Cooler
Precision thermal coolers for pump laser diode modules — W–Cu / high-purity copper stepped bases and micro-cavities with AuSn soldering compatibility, stabilizing wavelength and power output under rapid thermal changes.
- Materials
- Tungsten copper (W–Cu), high-purity copper, composite PM materials
- Features
- Efficient heat removal, optimized CTE behavior, high-precision cavities & steps for optical alignment, AuSn soldering and Au/Ni finishes
- Application
- Pump laser diodes for fiber and solid-state lasers, high-power LD arrays and submounts, photonics cooling platforms for industrial/medical/telecom lasers, precision optical assemblies.
Frequently Asked Questions
What materials and process are used for Pump Laser Diode Cooler?
Pump Laser Diode Cooler is made from Tungsten copper (W–Cu), high-purity copper, composite PM materials and is formed by MIM/PM (metal injection molding / powder metallurgy) near-net-shape and sintered to a relative density of ≥ 98%, which keeps mechanical properties close to wrought material.
What tolerances can Pump Laser Diode Cooler hold?
Typical as-sintered dimensional tolerance is ±0.3–0.5% of the dimension. Tighter tolerances are achievable with secondary sizing or machining, agreed per part during quoting.
What is the MOQ and lead time for Pump Laser Diode Cooler?
MOQ is 1000 pcs. Mold lead time is about 20 days (mold fee typically RMB 20–40k depending on part geometry), and production lead time is about 7 days once the mold is validated; secondary processing adds 3–5 days.
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