RF Heatsink

High-conductivity thermal components for RF & microwave devices — W–Cu / pure copper / PM composite bases, tabs and housings with CTE matched to GaN, GaAs and SiC for stable gain and low noise.

Materials: Tungsten copper (W–Cu), pure copper, PM composites
Features: Rapid heat dissipation, CTE-matched to GaN/GaAs/SiC, high dimensional stability under high-frequency thermal cycling, wire-bonding & soldering compatible
Application: RF power amplifiers, microwave transmit/receive modules, GaN/SiC high-frequency devices, satellite communication and radar systems, telecom base station hardware.

Request a Quote Product Catalog (PDF)

FAQ

Frequently Asked Questions

What materials and process are used for RF Heatsink?

RF Heatsink is made from Tungsten copper (W–Cu), pure copper, PM composites and is formed by MIM/PM (metal injection molding / powder metallurgy) near-net-shape and sintered to a relative density of ≥ 98%, which keeps mechanical properties close to wrought material.

What tolerances can RF Heatsink hold?

Typical as-sintered dimensional tolerance is ±0.3–0.5% of the dimension. Tighter tolerances are achievable with secondary sizing or machining, agreed per part during quoting.

What is the MOQ and lead time for RF Heatsink?

MOQ is 1000 pcs. Mold lead time is about 20 days (mold fee typically RMB 20–40k depending on part geometry), and production lead time is about 7 days once the mold is validated; secondary processing adds 3–5 days.