Microelectronic Mount
Engineered mounting platforms for semiconductor chips, laser diodes, photonic sensors and hybrid microelectronic assemblies — PM/MIM near-net-shape mounts with ultra-precise flat surfaces, cavities, slots and metallization.
- Materials
- Copper, Kovar, W–Cu, custom alloys
- Features
- Ultra-precise geometry and flat mounting surfaces, high mechanical rigidity, tailored CTE, customizable slots/holes/cavities/metallization, cost-efficient PM/MIM production
- Application
- Microelectronics and semiconductor packaging, laser diode / photonic sensor / MEMS module mounting, hybrid circuits and microwave assemblies, compact telecom and datacom devices.
Frequently Asked Questions
What materials and process are used for Microelectronic Mount?
Microelectronic Mount is made from Copper, Kovar, W–Cu, custom alloys and is formed by MIM/PM (metal injection molding / powder metallurgy) near-net-shape and sintered to a relative density of ≥ 98%, which keeps mechanical properties close to wrought material.
What tolerances can Microelectronic Mount hold?
Typical as-sintered dimensional tolerance is ±0.3–0.5% of the dimension. Tighter tolerances are achievable with secondary sizing or machining, agreed per part during quoting.
What is the MOQ and lead time for Microelectronic Mount?
MOQ is 1000 pcs. Mold lead time is about 20 days (mold fee typically RMB 20–40k depending on part geometry), and production lead time is about 7 days once the mold is validated; secondary processing adds 3–5 days.
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