Copper Alloy Heat Sink
Copper alloy heat sinks for high-efficiency thermal management in compact, high-power electronics — MIM integrates micro-fins, internal channels and optimized flow paths directly into near-net-shape parts.
- Materials
- Alloyed copper (in-house copper powders)
- Features
- Exceptional thermal conductivity, oxidation and thermal fatigue resistance, complex micro-fin geometry, lightweight near-net-shape production
- Application
- Consumer electronics, power electronics (IGBT modules, MOSFETs, LED drivers), automotive & aerospace electronics, high-density circuit boards.
Frequently Asked Questions
What materials and process are used for Copper Alloy Heat Sink?
Copper Alloy Heat Sink is made from Alloyed copper (in-house copper powders) and is formed by MIM/PM (metal injection molding / powder metallurgy) near-net-shape and sintered to a relative density of ≥ 98%, which keeps mechanical properties close to wrought material.
What tolerances can Copper Alloy Heat Sink hold?
Typical as-sintered dimensional tolerance is ±0.3–0.5% of the dimension. Tighter tolerances are achievable with secondary sizing or machining, agreed per part during quoting.
What is the MOQ and lead time for Copper Alloy Heat Sink?
MOQ is 1000 pcs. Mold lead time is about 20 days (mold fee typically RMB 20–40k depending on part geometry), and production lead time is about 7 days once the mold is validated; secondary processing adds 3–5 days.
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