Copper Tungsten Heat Spreaders
W-Cu heat spreaders for high-power electronics, laser diodes, RF modules and semiconductor packages — high thermal conductivity with low, CTE-matched expansion, stable under continuous thermal cycling.
- Materials
- Tungsten copper (W-Cu), W70Cu30 / W80Cu20
- Features
- Exceptional thermal conductivity, CTE matching to semiconductors, machinable micro-channels and mounting pads, Au/Ni plating and soldering compatible, self-developed tungsten powders
- Application
- High-power laser diode cooling, semiconductor power modules and RF devices, optical transceivers and coherent photonics, aerospace electronics, industrial/telecom/defense high-density systems.
Specifications
| Parameter | Value |
|---|---|
| Composition | W70Cu30 / W80Cu20 |
| Surface Compatibility | Au/Ni plating, soldering, water-cooled interfaces / Au/Ni 电镀、焊接、水冷界面 |
Frequently Asked Questions
What materials and process are used for Copper Tungsten Heat Spreaders?
Copper Tungsten Heat Spreaders is made from Tungsten copper (W-Cu), W70Cu30 / W80Cu20 and is formed by MIM/PM (metal injection molding / powder metallurgy) near-net-shape and sintered to a relative density of ≥ 98%, which keeps mechanical properties close to wrought material.
What are the key specifications of Copper Tungsten Heat Spreaders?
Typical specifications: Composition: W70Cu30 / W80Cu20; Surface Compatibility: Au/Ni plating, soldering, water-cooled interfaces / Au/Ni 电镀、焊接、水冷界面. The full parameter list is in the specifications table on this page; custom requirements can be discussed against your drawing.
What is the MOQ and lead time for Copper Tungsten Heat Spreaders?
MOQ is 1000 pcs. Mold lead time is about 20 days (mold fee typically RMB 20–40k depending on part geometry), and production lead time is about 7 days once the mold is validated; secondary processing adds 3–5 days.
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