Zhen Ding Exhibits at SEMICON Taiwan, Comprehensively Showcasing High-End PCB Technological Capabilities
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Zhen Ding Technology Group showcased high-end optical module products such as 800G, 1.6T, XPO, and NPO, as well as up to 34-layer high-end AI server boards at the SEMICON Taiwan 2026 International Semiconductor Exhibition. Ranging from high-speed transmission to ultra-high-layer boards, the exhibition comprehensively demonstrates the group's advanced PCB technological capabilities in response to the infrastructure needs of next-generation AI computing.
With the rapid improvement of AI chip performance and the continuous expansion of computing cluster scales, data centers face escalating demands for bandwidth, transmission speed, and energy efficiency. These trends further raise the technical barriers for PCBs in terms of materials, layer counts, signal integrity, and precision manufacturing. From AI servers to high-speed optical modules, high-end PCBs have become a crucial foundation supporting the continuous upgrade of AI computing power.
Zhen Ding stated that this exhibition focuses on two major product lines: high-performance optical transceivers and high-end AI server boards. In the high-performance optical module sector, Zhen Ding exhibited 800G and the latest 1.6T high-end optical modules, covering next-generation applications such as XPO and NPO, targeting the large bandwidth and low latency requirements of new-generation data centers. The products combine SLP (mSAP) precision processes with embedded via technology, providing the market with more energy-efficient transmission solutions.
In terms of high-end AI server boards, Zhen Ding showcased ultra-high-layer server boards with up to 34 layers on-site. This series of products adopts Ultra/Extreme Low Loss materials and M8-grade technical standards, fully incorporating extreme processes such as VIPPO, back drilling, and high aspect ratio plating. This demonstrates the group's technological advantages in high-frequency, high-speed transmission and precision impedance control.
In addition, Zhen Ding simultaneously showcased a variety of cutting-edge edge AI-related application products on-site, presenting its diverse manufacturing capabilities in extending AI technology from cloud computing to terminal devices. Collaborating with key ecosystem partners, the company presented a high-performance, low-energy semiconductor collaborative operation system to meet the high standards of cross-industry customers for real-time computing and data privacy.
Chien Chi-lun, Assistant Vice President of Zhen Ding Group, delivered a keynote speech on September 2, titled "The AI Era: Next-Generation PCB Technology and Global Layout." Starting from the continuous expansion of AI capital expenditure and computing power demand, he analyzed how AI is driving the PCB industry to experience both "overall volume growth" and "high-end transformation." He also highlighted how PCBs are evolving from traditional "passive connections" to become a key platform supporting high-speed computing, system integration, and data transmission.
According to the presentation citing Prismark data, as reported by technice.com.tw, the global PCB market size is expected to exceed USD 140 billion by 2030, with the proportion of high-end PCBs also expected to surpass 60%. This indicates that the industry's growth momentum is accelerating towards high-end applications.
Zhen Ding stated that the AI wave is accelerating the paradigm shift in global technology infrastructure and supply chains, continuously elevating the role and value of high-end PCBs in overall systems. As the world's largest PCB supplier, Zhen Ding has completed its strategic positioning in technological R&D and global capacity allocation.
Sources
- technice.com.tw (September 2, 2026) - Original link: Zhen Ding Exhibits at SEMICON Taiwan, Comprehensively Showcasing High-End PCB Technological Capabilities - https://technice.com.tw/issues/semicon/274773