Power Usage in AI Data Centers, vStrata Vertical Power Delivery, Power GaN Device Scaling Challenges: Electronics Week Insights

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Power Electronics News

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Power Usage in AI Data Centers, vStrata Vertical Power Delivery, Power GaN Device Scaling Challenges: Electronics Week Insights / AI数据中心功耗、vStrata垂直供电、功率GaN器件扩展挑战:电子周洞察

Republished by Newlife - MIM. All rights belong to the original publisher; see Source below.

Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on Power Usage in AI Data Centers, vStrata Vertical Power Delivery, and Power GaN Device Scaling Challenges!

NEWS

Infineon Expands AI Power Management with C2i Acquisition C2i adds digital multiphase control and smart power-stage expertise to Infineon’s portfolio, strengthening power delivery from grid to AI processor.

GlobalFoundries Acquires Photeon Technologies’ IVR business The deal integrates Photeon’s IVR technology, R&D capabilities, and engineering expertise to address rising demands for power efficiency.

TI Introduces Multiaxial Hall-Effect Current Sensor for EV Inverters The current sensor combines multiaxial sensing with an algorithm to reduce displacement error and improve torque control in EV powertrains.

Coherent Samples 300mm SiC Substrates for AI Infrastructure Customer sampling validates Coherent’s 300mm SiC platform for advanced thermal management, packaging and high-density computing.

Porsche Brings GaN Technology to High-End Automotive Audio The GaN-based power stage reduces heat and cooling requirements, enabling a lighter amplifier with smaller passive components.

Vishay Introduces RPWA 650W Thick-Film Power Resistors The low-profile devices integrate optional NTC sensing and customizable cabling while supporting up to 6kV and 3.5J repetitive pulse energy.

ARTICLES

Power Usage in AI Datacenters and its Relevance to Energy Infrastructure From 800 V bus transitions to AI-RAN edge networks, AI is fundamentally restructuring data center power infrastructure.

Power GaN Device Scaling Challenges Wafer substrate selection, buffer layer design, and 2-DEG optimization are key to scaling GaN power devices higher.

Lotus Microsystems Moves Power Conversion Under AI Processors LSC0580 combines silicon interconnects, integrated passives, and thermal management to reduce the power delivery path to AI processors.

Source

- Power Electronics News (2026-08-28) - Original article: Power Usage in AI Data Centers, vStrata Vertical Power Delivery, Power GaN Device Scaling Challenges: Electronics Week Insights

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