Over 10 Projects Landed: A Handful of Clay is Being Packed into "Chips"
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Recently, Dingshu Town in Yixing City held a conference on the innovative development of characteristic industries. A notable scene at the meeting deserves attention: Zisha craftsmanship masters, including Ji Yishun, Fan Weiqun, and Dong Yafang, shared the stage with multiple fund investors and were appointed as industrial investment promotion representatives.
On one side are the most classic cultural symbols of the thousand-year-old pottery capital, and on the other side is the most active capital force today. This cross-sector "think tank" for investment promotion is a vivid exploration of Dingshu's strategy to promote the transformation of characteristic industries based on its own endowments: sending what it does best to where it is most needed.
Today, a handful of clay from Dingshu has anchored a new coordinate on the map of high-end manufacturing. According to 163.com, among the 19 investment and cooperation project results showcased at the conference, more than 10 projects involve the advanced ceramics industry, featuring high technological content and sufficient development potential. Consequently, ceramics have completed the identity leap from "utensils" to "materials," transforming into key components for high-end manufacturing such as power modules for new energy vehicles and bases for chip packaging. With advanced ceramics as the pivot, the new chain of the semiconductor industry is being integrated. This year, the Advanced Ceramics Technology Industrial Park was selected as a key park for characteristic and advantageous industries in Wuxi.
The profound accumulation of industrial development has become a strong engine for investment promotion.
Ceramic substrates serve as the "foundation" and "heat sink" for chips and power devices, representing the preferred technical route for high-end chip manufacturers to solve heat dissipation challenges. The Yinghe High-Power Semiconductor Ceramic Substrate Production Project, with a total investment of 500 million RMB, focuses on the high-end electronic ceramics field. It will build intelligent production lines and an R&D center for ceramic substrates such as alumina and aluminum nitride in Dingshu, Yixing. The project's products are widely used in high-power semiconductor devices, new energy vehicles, photovoltaic energy storage, and other fields, helping to make up for the shortcomings of the regional high-end electronic ceramics materials industry.
The Kabeini Advanced Ceramic Device Application Innovation and Industrialization Platform Construction Project will build production lines for advanced ceramic precision devices such as ceramic manipulators and insulators in Yixing, creating an advanced ceramics R&D and production base in the pan-semiconductor field. The products target the pan-semiconductor, fuel cell, and high-end equipment tracks, achieving domestic supporting for key components. Currently, the enterprise has deeply cooperated with industry leaders such as SMIC, YMTC, and NAURA.
A group of local enterprises deeply engaged in segmented tracks has become the most solid endogenous force for industrial transformation.
Kexing Alloy focuses on the R&D and production of rare metal products such as molybdenum and tungsten. It is the only enterprise in China capable of mass-producing double-sided polished molybdenum substrates for high-power LED light-emitting chips. In the segmented field of molybdenum products for power semiconductors, Kexing's production volume has reached a globally leading position. "With the rapid development of the semiconductor industry, relying on years of technical accumulation and early industrial layout, the enterprise has quickly enjoyed the development dividends," introduced Yu Ye, the general manager of the enterprise. Focusing on the field of high-end materials for power semiconductors, Kexing Alloy has invested 500 million RMB to rapidly lay out the IGBT supporting heat sink material substrate project. The project will mass-produce core products such as molybdenum rounds, tungsten-copper, molybdenum-copper products, and IGBT molybdenum substrates. The products deeply serve domestic and international industry leaders such as Infineon, ABB, and CRRC Zhuzhou, effectively strengthening the new materials industry chain for semiconductors in Yixing.
Hongyi Ceramics has invested in the industrialization project of high-reliability ceramic packaging components for new energy vehicles and energy storage systems. It professionally mass-produces high-end ceramic packaging components for new energy vehicles and energy storage systems, serving well-known enterprises such as Midea, Haier, and E-JIO Electronics, helping Yixing's new energy precision ceramics industry to improve quality and efficiency.
When "attracting enterprises through existing enterprises" becomes the new normal, the level of industrial development continues to rise.
Shenzhen Jinhao Investment Group has invested 1 billion RMB to upgrade and transform low-efficiency land in the park, planning and constructing about 150,000 square meters of high-end manufacturing factories and R&D pilot workshops to accurately attract high-quality scientific and technological innovation and manufacturing enterprises. Instead of relying on new land indicators, they turn old factories into new carriers. This is Dingshu's understanding of intensive development. At present, Jinhao Industrial Park has connected with multiple high-quality enterprises in the fields of precision manufacturing, semiconductors, and electronics, and landed at this innovative development conference. Among them, the investor of the semiconductor power device packaging and manufacturing project is the first domestic chip packaging and testing enterprise to adopt the optoelectronic co-packaging process. The project plans to invest in building a comprehensive one-stop semiconductor IC packaging and testing service, aiming to build a leading domestic integrated circuit manufacturing and technology service provider. The precision testing machine equipment manufacturing project, with a total investment of 400 million RMB, will focus on the production and manufacturing of equipment such as the design and manufacturing of testing fixtures for the semiconductor industry and non-standard automation design and manufacturing, while also delving into the R&D and manufacturing of AI computing power equipment.
Sources
- 163.com › web (2026-10-19) - Original link: Over 10 Projects Landed: A Handful of Clay is Being Packed into "Chips" - https://www.163.com/dy/article/L9KM90TJ05568W0A.html